Micron Technology, Inc.                             Boise, Idaho

• CMP Section Manager (9/97-6/98):  Responsible for all CMP production for two fabs.  This included daily engineering issues, process development and improvement, SPC, defect reduction and yield management.  Responsible for 24/7 activities of a 50 person team of process engineers, shift engineers and technicians.
• Senior Engineer (1/97-9/97):  Responsible for all CMP process development and improvement for the production CMP area which serviced two fabs.  Directly supervised 6 process engineers and technicians.
• Process Development Engineer (2/94-1/97):  Development engineer in the R&D fab.  Increasing responsibilities for CMP process development and transfer to production.
• 40 U.S. patents issued during tenure at Micron, primarily involving semiconductor processing.  List available upon request.

IBM Corporation                                       Tucson, Arizona

• Advisory Engineer/Scientist (6/92-1/94):  Materials Science team member with responsibilities for material and chemical issues for all products from the Tucson development lab.  Research activities emphasized development of magnetic ink slurries for storage tape applications and development of techniques for analyzing contaminants from commercial printing inks in IBM printers.  Supervised daily activities of three technicians.  Performed a variety of material and chemical analysis, materials selection and troubleshooting.   Site expert for adhesive use/selection and worked with a variety of designers and engineers on product development.
• Development Staff Member (1/90-6/92) 

Sematech                                                     Austin, Texas

• Technical Staff Member (3/89-12-89):  Selected for training program for newly graduated Ph.D.’s. Worked as a development engineer in contamination engineering.  Primary focus was on wet cleans support.  Involved in early CMP efforts at Sematech with emphasis on post-CMP cleaning.